SWINDON Silicon Systems highlight SoC and SiP technology at Sensor + Test 2016
SWINDON Silicon Systems will be highlighting the advantages of System on Chip (SoC) and System in Package (SiP) solutions as part of ASIC development and production on Stand 334 at Sensor + Test 2016.
- (1888PressRelease) April 14, 2016 - On Stand 334 in Hall 5 at the Sensor + Test exhibition in Nurnberg, SWINDON Silicon Systems will be highlighting the advantages of System on Chip (SoC) and System in Package (SiP) solutions for automotive and industrial sensor applications as part of a mixed signal ASIC development and supply project. As more companies are realising the many advantages these single package electronic systems can offer, SWINDON, already renowned for its design expertise and experience in the supply of mixed signal ASICs, will be at the show to share its experience and help customers choose the right solution for their particular applications.
Members of the SWINDON team will highlight the advantages of SoC and SiP systems for industrial and automotive applications and show how they are customised in-house to customers' exact requirements, resulting in higher performance, smaller size and lower costs. For those unfamiliar with the terms, a SoC is a complete electronic system that may contain analogue, digital and radio frequency functions with the added advantage of a powerful processor as its core whereas a SiP is typically an ASIC / SoC integrated with another IC, usually a microelectromechanical sensor (MEMS) - all in a single package.
Visitors to the stand will also be able to discuss how SWINDON provides a full turnkey service that delivers optimised solutions for all industrial and automotive applications. The SWINDON solution combines technical innovation and excellence with high performance and low cost custom devices, delivering a solution that provides the competitive edge, both technically and commercially.
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