Molex Debuts zSFP+ Interconnect System for 56 Gbps Channels
Molex has expanded its zSFP+ Interconnect Systemto support 56 Gbps PAM-4 channels in a stacked 2xN port configuration, allowing next-generation Ethernet and Fiber Channel applications to receive standout signal integrity.
- (1888PressRelease) August 10, 2017 - Hong Kong, Asia - The product is the first of its kind on the market. OEMs requiring high-density interconnect applications now have the ability to utilize channels with individual lane data rates up to 56 Gbps PAM-4 in a stacked 2xN configuration. While providing those high speeds, the updated Molex product still maintains a low insertion loss, crosstalk, thermal and electromagnetic interference (EMI) containment that users are accustomed to from the previous zSFP+ Interconnect System.
The updated system has multiple features that allow for greater flexibility and lowered costs for users. The 56 Gbps PAM-4 channel products include EMI ganged cages—which are available in multiple port sizes from 2x1 through 2x12—allows for flexibility of PCB signal routing of LEDs.
Molex has also created a next-generation terminal and wafer on the stacked integrated connectors within the zSFP+ Interconnect System. The advanced terminal provides superior signal integrity for 56 Gbps PAM-4 applications. The system allows for users to merge standard cables and modules with the increased data-rate accepted.
Heilind Asia can also give the service and support for all customers. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry's leading manufacturers in 25 component categories, with a particular focus on interconnect and electromechanical products.
About Heilind Electronics:
Founded in 1974, Heilind Electronics, Inc. (www.heilind.com) is one of the world's leading distributors of connectors, relays, switches, thermal management & circuit protection products, terminal blocks, wire & cable, wiring accessories and insulation & identification products. Heilind has over 40 facilities in the United States, Canada, Mexico, Brazil, Germany, Hong Kong, Singapore and China.
Heilind Asia Pacific (www.heilindasia.com) commenced operations in Dec 2012, and now has 19 locations throughout Asia. Its industry leading service offering to customers in Asia Pacific is the result of a commitment to the belief of "Distribution As It Should Be".
About Molex
Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, and consumer electronics, industrial, automotive, medical, military, lighting and solar. Established in 1938, the company operates 39 manufacturing locations in 16 countries. The Molex website is http://www.molex.com.
Press Contact:
sarah luo
Heilind Asia Pacific
RM 1707-10,DELTA HOUSE,3 ON YIU ST
26119634
http://www.heilindasia.com/
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