Innovative Valve Technology with QuickFix Nozzle Unit Boosts Performance of Solder Paste Dispensing Applications
VERMES Microdispensing launches the new MDFH-48-CH-TA (Micro Dispensing Fluid Box Heater) that performs excellent dispensing results when used with the Micro Dispensing System MDS 3290+. The solution addresses the high and highest viscous market, especially the solder paste applications.
- (1888PressRelease) July 05, 2017 - Munich, Germany – VERMES Microdispensing introduces the new MDFH-48-CH-TA (Micro Dispensing Fluid Box Heater) that provides excellent results for high and highest viscous media, especially in automated solder paste applications.
By combining the MDS 3250+ system with the new fluid box heater MDFH-48-CH-TA VERMES Microdispensing has developed a further technical improvement that allows for process-safe, minimal solder paste quantities in a reliable and resource-saving way meeting most demanding customer requirements.
A key area for solder paste is the mounting of electronic components in the printed circuit boards assembly, for example for the application of electronic components on pads. This process requires the highest and very constant dispensing quality.
Equipped with a controller and a valve specially designed for sophisticated, highest viscous media the MDS 3250+ has become the system of choice for these applications. With its integrated fluid box heater and the optimized media guidance of the newly developed MDFH-48-CH-TA solder pastes of various types and classes can be dispensed for multiple applications.
The innovative „QuickFix” nozzle unit allows for a particularly effective and user friendly adjustment of tappet and nozzle. For many dispensing processes the very slim design adds a better control even for smallest components that are most difficult to access.
In order to meet also extremely fine high-precision dispensing requirements VERMES Microdispensing has continued to optimize its valve systems so that they are now able to apply even smallest possible droplets with a small drop diameter at highest reproducibility.
„High-performance dispensing systems that are able to dispense ultra-small structures become more and more important for electronics manufacturing“, explains Jürgen Städtler, CEO of VERMES Microdispensing. „Our flexible jet system MDS 3250+ can be perfectly adapted to specific and challenging processes thanks to the system’s modular concept. Specially designed for solder paste and high and highest viscous media the MDS 3250 + solution delivers shortest dispensing cycles with high dynamics and frequencies.”
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