IDT to Offer Expertise on DDR4 Memory Ecosystem and Exhibit Industry-leading Semiconductor Solutions at 2013 Intel Developer Forum
IDT will participate in DDR4 Memory Ecosystem Panel and Showcase Latest Innovations that Complement Intel-based Enterprise and Consumer Computing Platforms.
- (1888PressRelease) August 31, 2013 - Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced that it will join other experts in DDR4 technology on a memory ecosystem discussion panel as well as exhibit its industry-leading products at the 2013 Intel® Developer Forum, September 10-12. IDT will showcase select products that power, connect, and support Intel-based products and systems, including DDR4 memory interfaces, PCI Express® (PCIe®), timing, signal integrity, and RapidIO® solutions. IDT's latest power management and magnetic resonance wireless power solutions will also be on display.
Rami Sethi, vice president and general manager for memory interface products at IDT, will participate alongside industry veterans from Intel and Micron on a DDR4 memory ecosystem panel. The panel of experts will cover topics such as DDR4 features and benefits, an analysis of the market transition, and details on DRAM, registers, buffers, temperature sensors, and other ecosystem components necessary for a successful transition to this latest memory technology. IDTwill also participate in the memory community at IDF (Booth 158) alongside other industry leaders active in the development and use of memory-related components and technologies.
IDT will demonstrate the industry's first PCIe 3.0 signal-conditioning re-timers along with its latest high-performance PCIe switches, targeted at enterprise computing, storage and communications applications. IDT will also showcase its latest memory interface products, including the industry's first complete DDR4 LRDIMM chipset along with high performance timing solutions and the industry's first PCI Express Gen 2 to Serial RapidIO Gen 2 protocol conversion bridge - a breakthrough device that extends scalable RapidIO-enabled peer-to-peer multiprocessor clusters to the x86 processor environment.
IDT will also provide information about its recently-announced intelligent, scalable, and distributed power managementsolution developed and validated for Intel® Atom™ processors. IDT's patented solution is designed to meet the cross-platform power requirements of various Intel-based applications with a single power management IC (PMIC). In addition, information onIDT's latest wireless power solutions, including magnetic resonance information, will be available at the IDT booths. Near-field magnetic resonance is behind the Alliance for Wireless Power (A4WP) technology to provide flexible positioning of devices to be charged. Intel recently joined the A4WP board of directors alongside IDT, Qualcomm, Samsung, and other industry leaders.
The Intel Developer Forum will be held at the Moscone Center - West in San Francisco, California, September 10-12. IDT will be in Booths 222 and 224, and also in the memory community, Booth 158.
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